LGA1700/ 1800 1U, Passive (D17P series)

D17P series
(for LGA1700/ LGA1800 1U, Passive)

D17P stands for “Passive” coolers designed for for Intel LGA1700/ 1800 Alder S CPU series and indicated to our RGD3128xxx-P families.

[Meets]
1U Passive Coolers, TDP: 125 Watts (min.)

[Features & Benefits]
High quality, high reliability, customization available

>>　Target Market　<<
AI Edge Computing
Server Based IPC
High Performance Computing(HPC)

P/N : RGD3128-P2-002

TDP: 65W~125W
Outline Dimension : 88 x 88 x 25 mm
Heat Sink : Skived Copper Heat Sink
Thermal Resistance : 0.209℃/W @40CFM
Weight : 470 g

2D 3D Report

P/N : RGD3128VCL-P-002

TDP: 125W (min.)
Outline Dimension : 90 x 90 x 25mm
Heat Sink : Stacked Aluminum Fin with Vapor Chamber Base
Thermal Resistance : 0.150℃/W @ 40CFM
Weight : 210 g

2D 3D Report

P/N : RGD3128VC-P-002

TDP: 125W (min.)
Outline Dimension : 90 x 90 x 25 mm
Heat Sink : Stacked Copper Fin with Vapor Chamber Base
Thermal Resistance : 0.125 ℃/W
Weight : 370 g

2D 3D Report

Features

- Long term supply
- Fast samples
- Semi-customization available

Specification

Part Number	RGD3128-P2-002	RGD3128VCL-P-002	RGD3128VC-P-002
CPU Socket	Intel Desktop LGA1700 65~125W	Intel Desktop LGA1700 125W (min.)	Intel Desktop LGA1700 125W (min.)
Outline Dimension (mm)	88 x 88 x 25	90 x 90 x 25	90 x 90 x 25
Rth (℃/W)	0.209 (@40CFM)	0.150 (@40CFM)	0.125 (@40CFM)
Fan Spec	N/A	N/A	N/A
Heat Sink Material	Skived Copper Heat Sink	Stacked Aluminum Fin with Vapor Chamber Base	Stacked Copper Fin with Vapor Chamber Base