Case Studies

Server application, 55W [Belgium]

To try to resolve the heat issues from the chassis of server, including the QSFP and SFP connections, by heat sink & 4 fans.

Analysis

Server application, AMD EYPC3000, 100W [USA]

To resolve the heat issue by optimizing the thermal concept to better fit the thermal performance expected by customer, including the buffer reserved for overclocking operations if any.

Analysis

IGBT - CNC machining center [Australia]

To satisfy the thermal demand of IGBT in 200W & 430W by using the current space limitation of the equipment.

Analysis

MPLS router, 230W+180W [Russia]

To resolve the harsh conditions from Dual chip designs in 180W & 230W of realizing the new concept still under planning.

Analysis

Data Center, 122.2W [Russia]

To resolve the harsh conditions from Dual chip designs in 122.2W, that’s strictly asked for turning it into productions as planned schedules.

Analysis

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