SEV (for AMD/ INTEL)
SEV series
(for AMD Socket SP6, LGA4844)
SEV stands for the EVAC of REGO mainly used in Server applications, made for both of INTEL & AMD series and indicated to our RGBxxx & RGExxx families as listed below:
Here’s the ultimate solution by air before switching to liquid cooling for resolving TDP below 500W. It’s an advanced air-cooling solutions like Extended Volume Air Cooling (EVAC) heat sinks are more ideal to
adopt in case of space limit and post-maintenance concern. EVAC has used almost every inch of possible area to maximize the dissipating performance by heat pipes or thermosiphon tubes to promptly transfer the heat to regions where more physical volume is available for additional heat exchangers to deliver the best overall performance. With these extra cooling surfaces (extended parts), the thermal performance of the heat sink can be efficiently improved accordingly.
[Meets]
1U/ 2U available
INTEL LGA4677 LGA7529 series
AMD SP3 SP5 SP6 series
TDP: 300 to 500 Watts
[Features & Benefits]
for Mid/ High-End Servers mainly
High Reliability & Stability
Cost-effective from SAVING (v.s. Liquid Cooling):
- Extra maintenance fee
- Risk of leakage
.
>> Target Market <<
Server
Storage
AI
Telecommunication
![](/ezfiles/925/1925/img/4500/Group.jpg)
![](/ezfiles/925/1925/img/5104/46771UEVACTOP.jpg)
![]( /ezfiles/925/1925/img/5104/46771UEVAC.jpg)
![]( /ezfiles/925/1925/img/5104/46771U+2UEVACTOP.jpg)
>> Fast samples
>> Harsh-conditions allowed
>> Semi-customization available
Thermal Dissipation Performance |
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Copper Base w/ heat pipes |
Copper Base w/ heat pipes |
Copper Base w/ heat pipes |
Copper Base w/ heat pipes |
Copper Base w/ heat pipes |
Copper Base w/ heat pipes |