| Part Number | ALExx30-1331xxx | ALExx44-1430xxx | ALExx59-0924xxx |
| CPU Socket | 5G M.2 | FPGA | RF |
| Outline Dimension (mm) |
Upper Fan Heat Sink : 30(W) x 13.1(H) x Optional(L) Lower Heat Sink 34(W) x 9.4(H) x Optional(L) |
44(W) x 13.5(H) x Optional(L) | 59.4(W) x 9.3(H) x Optional(L) |
| Rth (℃/W) | |||
| Fan Spec | Axial 3010 | AAxial 4010 | Axial 4006 |
| Heat Sink Material | Extruded aluminum | Extruded aluminum | Extruded aluminum |
Tailor-made IoT series
Tailor-made IoT series
Features & Benefits -
-Cooler type & size, fully customized, with TDP ranged from 10 Watts to 20 Watts
-Best fit size & performance, One-Stop-Design support by REGO’s thermal RD team
-Cost saving by semi-customization from our available standard molds.
Please note that not all of products/molds are listed and shown here. If you are unable to locate the product you're looking for, don't hesitate to reach us for more info or requests.
ALExx30-1331xxx
Application: 5G M.2 Cooler
Upper Fan Heat Sink : 30(W) x 13.1(H) x Optional length
Lower Heat Sink : 34(W) x 9.4(H) x Optional length
Heat Sink : Extruded Aluminum
Fan : 30 x 30 x 10 mm, Two ball Bearing,
RPM/Airflow/Noise Level : Optional
Connector Type : Optional
Hardware : Optional
ALExx44-1430xxx
Application : RF Tester Cooler
Outline Dimension : 44(W) x 13.5(H) x Optional(L) mm
Heat Sink : Extruded Aluminum
Fan : 40 x 40 x 10.5 mm, Two Ball Bearing,
RPM/Airflow/Noise Level : Optional
Connector Type : Optional
Hardware : Optional
ALExx59-0924xxx
Application : FPGA Cooler
Outline Dimension : 59.4(W) x 9.3(H) x Optional(L) mm
Heat Sink : Extruded Aluminum
Fan : 40 x 40 x 6 mm, Hypro Bearing,
RPM/Airflow/Noise Level : Optional
Connector Type : Optional
Hardware : Optional
